Particle-Related Issues During SMA:

 

The process SMA (or surface mount assembly) of preparing bare-board Printed Circuits to receive components involves the particle-sensitive process of solder paste printing. International competiton has driven prices and margins to wafer-thin levels and as such maximising first-pass high yields is critical. The presence of particles under the solder paste can lead to connectivity problems requiring identification during inspection and then potential re-work or scrap.

 

A Solution:

 

High-performance particle-removal rollers are used every day in the assembly of surface mount components to permanently remove and discard loose contamination and particles from materials during the manufacturing processes. Ranging from hand-held manual robust units to stand-alone or fully integratable equipment, our range of particle removal solutions will deliver improved yields and enhance product quality and performance.

 

 

Which Tekena Products ?

 

 

 

 

 

For Manual Cleaning -

 

DCRT

Tacky Pads

WIPES

For Material in Sheet Form -

 

ARS

TSMC